SIA911EDJ-T1-GE3【PDF 1/9 页】MOSFET P-CH DL 20V PWRPAK SC70-6

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Sheet目录514

[1页]2页 3页 4页 5页

SiA911EDJ

Vishay Siliconix

Dual P-Channel 20-V (D-S) MOSFET

PRODUCT SUMMARY

V DS (V) R DS(on) ( Ω )

I D (A)

Q g (Typ.)

FEATURES

? Halogen-free According to IEC 61249-2-21

Definition

- 20

0.101 at V GS = - 4.5 V

0.141 at V GS = - 2.5 V

0.192 at V GS = - 1.8 V

- 4.5 a

-2

4.9 nC

? TrenchFET ? Power MOSFET

? New Thermally Enhanced PowerPAK ?

SC-70 Package

- Small Footprint Area

- Low On-Resistance

? Typical ESD Protection 4000 V

APPLICATIONS

? Load Switch, PA Switch and Battery Switch for Portable

Devices

PowerPAK SC-70-6 Dual

S 1

Markin g Code

S 1

S 2

D 1

G 1

D 2

Part # code

DHX

XXX

Lot Tracea b ility

and Date code

G 1

600 Ω

G 2

600 Ω

G 2

2.05 mm

S 2

2.05 mm

D 1

P-Channel MOSFET

D 2

P-Channel MOSFET

Ordering Information: SiA911EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted

Parameter

Drain-Source Voltage

Gate-Source Voltage

T C = 25 °C

Symbol

V DS

V GS

Limit

- 20

±8

- 4.5 a

Unit

Continuous Drain Current (T J = 150 °C)

Pulsed Drain Current

Continuous Source-Drain Diode Current

T C = 70 °C

T A = 25 °C

T A = 70 °C

T C = 25 °C

T A = 25 °C

T C = 25 °C

I D

I DM

I S

- 4.5 a

- 3.6 b, c

- 2.9 b, c

- 10

- 4.5 a

- 1.6 b, c

7.8

Maximum Power Dissipation

T C = 70 °C

T A = 25 °C

P D

1.9 b, c

T A = 70 °C

1.2 b, c

Soldering Recommendations (Peak Temperature)

Operating Junction and Storage Temperature Range

d, e

T J , T stg

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambient b, f

Maximum Junction-to-Case (Drain)

t ≤ 5s

Steady State

R thJA

R thJC

12.5

°C/W

Notes:

a. Package limited.

b. Surface Mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under Steady State conditions is 110 °C/W.

Document Number: 68927

S09-0389-Rev. B, 09-Mar-09

www.vishay.com

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